DISCO

Semiconductor Equipment · Precision Processing · Ota, Tokyo

DISCO Corporation, founded in 1937, manufactures and sells precision cutting, grinding and polishing machines and the diamond abrasive tools used with them. Its range includes dicing saws, grinders, polishers and wafer mounters for semiconductor and electronic-component manufacturers.

Alongside equipment and tools, DISCO provides machine maintenance, operation and maintenance training, leasing and used-machine trading, disassembly and recycling of old machines, and contract processing of precision parts. It had 7,379 consolidated employees, including contract staff, at the end of March 2026.