Lead efforts in advanced substrate packaging and wafer assembly solutions, collaborating with suppliers and managing production processes.
About this role
Intel is hiring Equipment Development Engineers in Tokyo for the METI-SATAS programme, which develops and deploys next-generation assembly and test process equipment, factory automation and material-handling systems for a pilot line in Japan. The role covers the whole equipment lifecycle from requirements and design through supplier integration, installation and qualification, with global Intel teams and external partners, and may focus on process equipment, automation and material handling, or systems integration.
The engineer defines equipment capability requirements across hardware, software and controls, leads design and integration of assembly and test equipment and automation (automated material handling, EFEMs, load ports), integrates tools into a pilot line with synchronised material flow, works with suppliers through build and qualification, runs testing and validation, reduces energy use and waste and helps develop SEMI standards.
Applicants need excellent Japanese and English, a bachelor's or master's degree in engineering, 7 or more years in process engineering, equipment development, systems integration or semiconductor or automation manufacturing, 5 or more years in project management and technical leadership,.
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