Supports semiconductor supply chain performance by analyzing systems, improving processes, managing material and supplier risks, and strengthening quality, reliability, yield, and cost outcomes.
About this role
Intel's Advanced Packaging Technology Development team, which develops substrate packaging and wafer assembly solutions for customers, is hiring Senior Program Managers in Tokyo within its Substrate Technology Integration Group. The work supports packaging for next-generation AI devices, including EMIB-T, a substrate technology that lets different kinds of chips be combined, and the qualification of new capacity at advanced packaging suppliers.
The program manager works with supplier engineering teams on site and the US integration team to advance substrate technologies, improves capacity in bottleneck processes to cut throughput time, oversees schedules for product and test-vehicle deliveries, analyses substrate lead times and builds reduction roadmaps, makes sure suppliers keep their process-control commitments, tracks milestones for new factory start-ups, and influences senior supplier management.
Applicants need a bachelor's or master's degree with 8 or more years, or a doctorate with 4 or more years, in science or engineering, and 6 or more years in back-end fab or substrate process development. Substrate process, yield and capacity-management experience and fluent business English are preferred.
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