Support the METI-SATAS program, focusing on development, integration, and deployment of next-generation assembly and test process equipment.
About this role
Senior Program Manager, Advanced Packaging Technology Development (Substrate and Wafer Assembly) at Intel, within the Substrate Technology Integration Group. Work at the forefront of packaging technologies essential for next-generation AI devices: collaborate with substrate suppliers worldwide to drive innovation and scalability, contribute to deploying EMIB-T (next-generation advanced-packaging substrate technology enabling heterogeneous chip architectures), and lead efforts to qualify new capacity. Tokyo; full-time.
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